Thermally conductive materials

Thermally conductive materials ensure targeted heat dissipation, protection of sensitive components and optimum system performance. SPÄH offers solutions ranging from gap pads and silicone or ceramic-filled materials to nano and hybrid pads.

Typical applications: Heat dissipation between chips and heat sinks, thermal insulation, protection of sensitive components
Sectors of application: Electronics, automotive, medical technology, LED technology, industrial systems
Advantages at a glance:

• High thermal conductivity

• Flexible adaptation to uneven surfaces

• Wide range of materials: Silicone, ceramic, nano and hybrid pads

• Simple processing and customized cuts

• Optimum performance for demanding applications

Heat conducting materials from SPÄH – intelligent solutions for maximum efficiency.